Plasma Treatment, Cleaning and Surface Preparation

Selective Atmospheric Plasma Treatment using Rotation or Jet Nozzles

Atmospheric plasma treatment is a unique technology for surface treatment in electronic assembly: Nano-Cleaning, Removal of Organic Contaminants, Surface Activation/Modification, Surface Ablation and Etching, Hydrophiling, Passivation, Hydrophobing, Biocompatibility, and Plasma Coating of almost all materials – composites, plastics, metals, glass, cardboard, textiles, etc. With ANDA plasma technology, plasma surface treatment can be inserted inline with fluid dispensing or selective conformal coating.

Since Plasma is produced under a high voltage (15 ~ 20KV) discharge environment an ordinary plasma nozzle exhibits blow out or arcing at the tip which may contact the electronic assembly resulting in damage to sensitive components. ANDA Plasma treatment nozzles offer a “current absorption loop” to eliminate the high voltage arc at the discharge cavity and safely treat sensitive electronics.

ANDA Atmospheric Plasma Treatment System
Overall Size: 1200 x 1000 x 1600mm
Overall Weight: 500KG
Human Machine Interface: Windows PC or PLC + Touch Panel
X/Y Gantry: Stepper Motor + Synchronous Belt
Working Range: 450 x 450mm
Processing Distance: 3 ~ 15mm
Processing Speed: 20 ~ 200mm
Power: 230VAC 50/60Hz
Plasma Head: Rotation or Jet


    Standard Features

  • Rotation or Jet Nozzle
  • Touch screen or Windows PC control
  • PCB Stops
  • UPS and voltage stabilizer
  • ESD grounding Point
  • CE Compliant

    Optional Features

  • Heavy duty conveyor
  • Dual Lane conveyor system
  • 2 stage conveyor
  • CCD vision camera
  • Pallet return conveyor (Underneath)
  • Barcode or 2D code scanning system



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