The Anda vertical curing oven (VCO) uses recirculating hot air to accelerate printed circuit board assembly (PCBA) cure times for underfill, epoxy resin encapsulation, and adhesives. Our vertical curing oven works inline with production processes for eliminating manual loading/unloading of batch curing ovens. Unlike horizontal conveyor style ovens, the VCO Series accommodates larger quantities of boards utilizing a compact footprint. This makes vertical curing an ideal solution for processes where factory floor space is limited or in clean room environments.
The uninterrupted curing process of the VCO Series reduces manufacturing costs and improves both production and quality of assemblies. Unlike a batch oven, the doors on the VCO Series remain closed during production ensuring constant heat tracking throughout the curing process, this ensure coatings are precisely cured at controlled temperatures in order to maximize coating strength and provide better PCBA protection.
The Anda UV2 is a compact, inline full spectrum ultraviolet UV curing system suitable for high intensity, rapid curing of UV curable coatings, adhesives, and inks.
The Anda iCure is a compact, inline Infrared (IR) curing module suitable for high volume, rapid curing of heat curable coatings, adhesives and inks.