Plasma Treatment
VP Series Offline Vacuum Plasma Treatment Machine
Description
VP Series are offline standalone (batch style) plasma treatment units designed for immersive vacuum plasma treatment and activation of a materials surface energy. During this process, materials being treated are completely engulfed within a plasma environment allowing all surface areas of complex parts and materials to be treated and activated simultaneously.
In the electronics industry, we highly recommend plasma treatment prior to selective conformal coating or dispensing processes in order to improve wetting of coatings and the adhesion strengths of coatings and other dispensed materials. When materials are plasma treated, coatings and adhesives are significantly less susceptible to fail. Plasma treatment to electronics ensures maximum protection from coatings and glues and a long product life for the intended device.
Vacuum Plasma Treatment
Features & Benefits of Vacuum Plasma Treatment
- Adjustable Shelves: allow processing of a wide variety of part geometrics
- Batch Style: each unit is complete self-contained, requiring minimal floor space
- Ultra-low Temperature: system operation temperature as low as 40°C
- Omni-directional: complete immersion of the treated material by anisotropic plasma
- Environmentally Friendly: zero chemicals are used and no harmful substances are produced
- Cleaning: remove fine dust, oil, grease and organic compounds
- Activation: Increase surface energy to promote wetting and adhesion
Offline VP-Series Machine Specifications
| Plasma Treatment Configuration | |
|---|---|
| Chamber Size | L 403 × W 400 × H 403 mm (L 15.87″ x W 15.75″ x H 15.87″) |
| Electrode Plate Structure | Horizontal 8 Layers |
| Electrode Plate Size | L 320 x W 375 mm (L 12.60″ x W 14.76″) |
| Vacuum Pump | Two-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump |
| Vacuum Measurement | Pilani Resistance Vacuum Gauge |
| Working Vacuum | 10-100 Pa |
| Vacuum Time | ≤ 55 s |
| Vacuum Evacuation Time | ≤ 15 s |
| Gas Control Range | 0-300 SCCM |
| Gas Flow Sensor | High Precision Mass Flow Meter |
| Plasma Generator | 500 W |
| RF Power Supply | 0-500 W (adjustable range) |
| Automatic RF Matching | 500 W |
| Facility | |
| Standard Footprint | L 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″) |
| Weight | 560 kg |
| Power | 3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional) |
| Rated Power | 4.0 kW |
| Gas Generator | Two working gases are optional (Ar,N2,O2,CF4,CDA) |
| Pressure | 0.6 Mpa |
| Interface | |
| Controller | PLC Controller with Touch Panel |
| Plasma Treatment Configuration | |
|---|---|
| Chamber Size | L 450 × W 400 × H 450 mm (L 17.72″ x W 15.75″ x H 17.72″) |
| Electrode Plate Structure | Horizontal 8 Layers |
| Electrode Plate Size | L 320 x W 420 mm (L 12.60″ x W 16.54″) |
| Vacuum Pump | Two-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump |
| Vacuum Measurement | Pilani Resistance Vacuum Gauge |
| Working Vacuum | 10-100 Pa |
| Vacuum Time | ≤ 70 s |
| Vacuum Evacuation Time | ≤ 20 s |
| Gas Control Range | 0-300 SCCM |
| Gas Flow Sensor | High Precision Mass Flow Meter |
| Plasma Generator | 500 W |
| RF Power Supply | 0-500 W (adjustable range) |
| Automatic RF Matching | 500 W |
| Facility | |
| Standard Footprint | L 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″) |
| Weight | 580 kg |
| Power | 3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional) |
| Rated Power | 4.0 kW |
| Gas Generator | Two working gases are optional (Ar,N2,O2,CF4,CDA) |
| Pressure | 0.6 Mpa |
| Interface | |
| Controller | PLC Controller with Touch Panel |
| Plasma Treatment Configuration | |
|---|---|
| Chamber Size | L 470 × W 460 × H 470 mm (L 18.50″ x W 18.11″ x H 18.50″) |
| Electrode Plate Structure | Horizontal 8 Layers |
| Electrode Plate Size | L 380 x W 440 mm (L 14.96″ x W 17.32″) |
| Vacuum Pump | Two-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump |
| Vacuum Measurement | Pilani Resistance Vacuum Gauge |
| Working Vacuum | 10-100 Pa |
| Vacuum Time | ≤ 80 s |
| Vacuum Evacuation Time | ≤ 25 s |
| Gas Control Range | 0-300 SCCM |
| Gas Flow Sensor | High Precision Mass Flow Meter |
| Plasma Generator | 500 W |
| RF Power Supply | 0-500 W (adjustable range) |
| Automatic RF Matching | 500 W |
| Facility | |
| Standard Footprint | L 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″) |
| Weight | 630 kg |
| Power | 3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional) |
| Rated Power | 4.0 kW |
| Gas Generator | Two working gases are optional (Ar,N2,O2,CF4,CDA) |
| Pressure | 0.6 Mpa |
| Interface | |
| Controller | PLC Controller with Touch Panel |
| Plasma Treatment Configuration | |
|---|---|
| Chamber Size | L 500 × W 600 × H 500 mm (L 19.69″ x W 23.62″ x H 19.69″) |
| Electrode Plate Structure | Horizontal 8 Layers |
| Electrode Plate Size | L 470 x W 520 mm (L 18.50″ x W 20.47″) |
| Vacuum Pump | Two-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump |
| Vacuum Measurement | Pilani Resistance Vacuum Gauge |
| Working Vacuum | 10-100 Pa |
| Vacuum Time | ≤ 100 s |
| Vacuum Evacuation Time | ≤ 30 s |
| Gas Control Range | 0-500 SCCM |
| Gas Flow Sensor | High Precision Mass Flow Meter |
| Plasma Generator | 1000 W |
| RF Power Supply | 0-1000 W (adjustable range) |
| Automatic RF Matching | 1000 W |
| Facility | |
| Standard Footprint | L 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″) |
| Weight | 680 kg |
| Power | 3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional) |
| Rated Power | 4.5 kW |
| Gas Generator | Two working gases are optional (Ar,N2,O2,CF4,CDA) |
| Pressure | 0.6 Mpa |
| Interface | |
| Controller | PLC Controller with Touch Panel |
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