Plasma Treatment

Offline VP-Series

Offline Immersion Vacuum Plasma Treatment Machine

Description


The Anda Offline VP-Series are batch style plasma treatment units designed for ultrafine nanoparticle cleaning and activation of a materials surface energy. During this process, materials being treated are completely engulfed within a plasma environment allowing all surface areas of complex parts and materials to be treated and activated simultaneously.

In the electronics industry, we highly recommend plasma treatment prior to selective conformal coating or dispensing processes in order to improve wetting of coatings and the adhesion strengths of coatings and other dispensed materials. When materials are plasma treated, coatings and adhesives are significantly less susceptible to fail. Plasma treatment to electronics ensures maximum protection from coatings and glues and a long product life for the intended device.

Features & Benefits of Vacuum Plasma Treatment


  • Adjustable Shelves: allow processing of a wide variety of part geometrics
  • Batch Style: each unit is complete self-contained, requiring minimal floor space
  • Ultra-low Temperature: system operation temperature as low as 40°C
  • Omni-directional: complete immersion of the treated material by anisotropic plasma
  • Environmentally Friendly: zero chemicals are used and no harmful substances are produced
  • Cleaning: remove fine dust, oil, grease and organic compounds
  • Activation: Increase surface energy to promote wetting and adhesion

Offline VP-Series Machine Specifications


Plasma Treatment Configuration
Chamber SizeL 403 × W 400 × H 403 mm (L 15.87″ x W 15.75″ x H 15.87″)
Electrode Plate StructureHorizontal 8 Layers
Electrode Plate SizeL 320 x W 375 mm (L 12.60″ x W 14.76″)
Vacuum PumpTwo-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump
Vacuum MeasurementPilani Resistance Vacuum Gauge
Working Vacuum10-100 Pa
Vacuum Time≤ 55 s
Vacuum Evacuation Time≤ 15 s
Gas Control Range0-300 SCCM
Gas Flow SensorHigh Precision Mass Flow Meter
Plasma Generator500 W
RF Power Supply0-500 W (adjustable range)
Automatic RF Matching500 W
Facility
Standard FootprintL 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″)
Weight560 kg
Power3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional)
Rated Power4.0 kW
Gas GeneratorTwo working gases are optional (Ar,N2,O2,CF4,CDA)
Pressure0.6 Mpa
Interface
ControllerPLC Controller with Touch Panel
Plasma Treatment Configuration
Chamber SizeL 450 × W 400 × H 450 mm (L 17.72″ x W 15.75″ x H 17.72″)
Electrode Plate StructureHorizontal 8 Layers
Electrode Plate SizeL 320 x W 420 mm (L 12.60″ x W 16.54″)
Vacuum PumpTwo-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump
Vacuum MeasurementPilani Resistance Vacuum Gauge
Working Vacuum10-100 Pa
Vacuum Time≤ 70 s
Vacuum Evacuation Time≤ 20 s
Gas Control Range0-300 SCCM
Gas Flow SensorHigh Precision Mass Flow Meter
Plasma Generator500 W
RF Power Supply0-500 W (adjustable range)
Automatic RF Matching500 W
Facility
Standard FootprintL 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″)
Weight580 kg
Power3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional)
Rated Power4.0 kW
Gas GeneratorTwo working gases are optional (Ar,N2,O2,CF4,CDA)
Pressure0.6 Mpa
Interface
ControllerPLC Controller with Touch Panel
Plasma Treatment Configuration
Chamber SizeL 470 × W 460 × H 470 mm (L 18.50″ x W 18.11″ x H 18.50″)
Electrode Plate StructureHorizontal 8 Layers
Electrode Plate SizeL 380 x W 440 mm (L 14.96″ x W 17.32″)
Vacuum PumpTwo-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump
Vacuum MeasurementPilani Resistance Vacuum Gauge
Working Vacuum10-100 Pa
Vacuum Time≤ 80 s
Vacuum Evacuation Time≤ 25 s
Gas Control Range0-300 SCCM
Gas Flow SensorHigh Precision Mass Flow Meter
Plasma Generator500 W
RF Power Supply0-500 W (adjustable range)
Automatic RF Matching500 W
Facility
Standard FootprintL 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″)
Weight630 kg
Power3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional)
Rated Power4.0 kW
Gas GeneratorTwo working gases are optional (Ar,N2,O2,CF4,CDA)
Pressure0.6 Mpa
Interface
ControllerPLC Controller with Touch Panel
Plasma Treatment Configuration
Chamber SizeL 500 × W 600 × H 500 mm (L 19.69″ x W 23.62″ x H 19.69″)
Electrode Plate StructureHorizontal 8 Layers
Electrode Plate SizeL 470 x W 520 mm (L 18.50″ x W 20.47″)
Vacuum PumpTwo-stage Rotary Plate Vacuum Pump / Roots Vacuum Pump
Vacuum MeasurementPilani Resistance Vacuum Gauge
Working Vacuum10-100 Pa
Vacuum Time≤ 100 s
Vacuum Evacuation Time≤ 30 s
Gas Control Range0-500 SCCM
Gas Flow SensorHigh Precision Mass Flow Meter
Plasma Generator1000 W
RF Power Supply0-1000 W (adjustable range)
Automatic RF Matching1000 W
Facility
Standard FootprintL 1200 x W 920 x H 1690 mm (L 47.24″ x W 36.22″ x H 66.54″)
Weight680 kg
Power3 Phase 380 VAC (Standard), 208/480 VAC with transformer (Optional)
Rated Power4.5 kW
Gas GeneratorTwo working gases are optional (Ar,N2,O2,CF4,CDA)
Pressure0.6 Mpa
Interface
ControllerPLC Controller with Touch Panel