The Jet-8600 is a contactless jetting valve suitable for a wide range of fluid and adhesive dispensing applications which require high-speed precision with strict deposit tolerances. Fluid is dispensed onto substrates at speeds up to 200 Hz (dots per second) including assemblies with tight spaces without risk of collision because Z-axis is not required for jetting.
Applications:Adhesive Glues, Chip Package, Underfill, Pin Encapsulation, Dam & Fill, Edge Bonding & Encapsulation, Micro Coating
The PV-20 is a high-speed precision contactless jetting valve designed for micro dispensing applications. Minimum dot size 0.2 mm, suitable for micro dispensing low to medium viscosity materials onto flexible printed circuit (FPC) and printed circuit board (PCB) assemblies requiring high-speed precision dispensing with strict deposit tolerances. Constant process control of dispensed materials at temperatures up to 150° C with dispensing speeds up to 1000 Hz (dots per second).
The SV-06 is designed for precise repeatable dispensing of solder pastes and other medium to high viscosity materials. Equipped with a quick release lure lock design, allowing it to with various needle sizes and multiple fluid types. A variety of auger screw pitch options are available to achieve faster flow or higher material precision deposits.
Applications:Adhesive Glues, Solder Pastes, Damping Greases, Pin Encapsulation, Dam & Fill, Thermal Conductive
The PC1000 & 2000 are specialized screw valves which dispense one-component (1 K) or two-component (2K) materials with complete pressure-tight performance utilizing a specialized rotor-stator system. Controlled rotary motion gently dispenses material mediums without affecting structural performance through a displacement process which occurs in the stator, zero external forces are applied. Reverse flow material suck-back ensures controlled stop improving quality in dispensing results and provides mess-free easy maintenance.
Applications:Underfill, Pin Encapsulation, Dam & Fill, Metering, Ratio Mixing, Edge Bonding & Encapsulation
The Anda AD-16 Series is an inline high precision fluid dispensing system applicable for high volume processes involving SMT underfill, encapsulation, LTS, TIM, flux, semiconductor package, wafer bond etc.
The Anda iJet-7H is a multi-functional dispensing machine that delivers the highest operating speeds with a combined repeated accuracy of ±0.01 mm (10 µm) for high volume applications where speed, accuracy and precision are essential.
The Anda TSV Series is designed for offline tabletop selective coating and automated dispensing processes. This highspeed desktop dispenser series is extremely versatile making it ideal for low volume or laboratory applications.